22M400-8\6G藍牙模塊晶振\進口SMI石英貼片晶體22SMX，尺寸為2.50mmx2.00mm，頻率40MHZ，日本進口SMI晶振，超小型晶振，無源SMD晶振，石英貼片晶振，石英晶振，石英晶體諧振器，水晶振動子，無源石英晶振，低損耗貼片晶振，高性能晶振，高品質晶振，6G藍牙模塊專用晶振，6G無線晶振，路由器晶振，儀器設備晶振，便攜式設備晶振，物聯網專用晶振，可視化智能家居晶振，醫療產品專用晶振，產品具有低損耗高性能的特點，適合用于物聯網，藍牙模塊，路由器等領域。
貼片晶振外觀使用金屬材料封裝的,具有高穩定性,高可靠性的石英晶體,晶振外觀本身使用金屬封裝,充分的密封性能,可確保其高可靠性,采用編帶包裝,外包裝采用朔膠盤,可在自動貼片機上對應自動貼裝等優勢.22M400-8\6G藍牙模塊晶振\進口SMI石英貼片晶體22SMX.
22M400-8\6G藍牙模塊晶振\進口SMI石英貼片晶體22SMX參數表
| Item | Specifications | |||||
| Package type | 22SMX | |||||
| Frequency range | 40.000 MHz | |||||
| Frequency tolerance | ±30 ppm at +25。C ±3。C | |||||
| Temperature stability (referred to +25。C) | ±30 ppm over-20。C to +70。C | |||||
| Load capacitance (CL) | 8 pF, Typical | |||||
| Shunt capacitance (C0) | 5 pF max. | |||||
| Drive level (P) | 100 μW max. (10 μWfor testing) | |||||
| Aging | ±5 ppm max. at +25。C ±3。C per year | |||||
| Cut / Oscillation mode | AT-Cut / Fundamental | |||||
| Reflow condition | 10 seconds max. at +250。C ±10。C | |||||
22M400-8\6G藍牙模塊晶振\進口SMI石英貼片晶體22SMX 尺寸圖
SMD晶振特點：
尺寸：2.50mmx2.00mm
頻率范圍：16~80MHZ
低損耗高性能
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