2012mm,BC59,BC59CCD119.0-32.768K,Bomar32.768KHZ晶振，尺寸2.0x1.2mm，頻率32.768KHZ，歐美無(wú)源晶體，Bomar小體積晶振，2012mm音叉晶體，32.768KHZ實(shí)時(shí)時(shí)鐘晶振，貼片無(wú)源晶振，無(wú)源晶振，SMD晶振，高質(zhì)量晶振，高性能晶振，低損耗晶振，低老化晶振，兩腳貼片晶振，32.768KHZ無(wú)源晶振，移動(dòng)通信晶振，芯片卡晶振，實(shí)時(shí)時(shí)鐘晶振，無(wú)線通信設(shè)備晶振，具有超高的耐壓性能。
BC59系列是一種超小型陶瓷smd無(wú)源晶體，高度為0.6毫米。非常適合最小的電路空間可能的應(yīng)用包括移動(dòng)通信、芯片卡、實(shí)時(shí)時(shí)鐘和無(wú)線通信。2012mm,BC59,BC59CCD119.0-32.768K,Bomar32.768KHZ晶振.
2012mm,BC59,BC59CCD119.0-32.768K,Bomar32.768KHZ晶振 參數(shù)表
| Frequency Range | 32.768 kHz | |||||||||
| Frequency Tolerance @ 25ºC. | ±10ppm, ±20ppm, ±50ppm | |||||||||
| Temperature Coefficient | -0.045ppm / ºC² max. - See Graph Below | |||||||||
| Operating Temperature Range | -40º to +85ºC. | |||||||||
| Load Capacitance | 9.0pF | |||||||||
| Shunt Capacitance | 2pF max. | |||||||||
| Equivalent Series Resistance | 70k ohms max. | |||||||||
| Aging | ±3ppm/ 1styear max. | |||||||||
| Drive Level | 0.1µW max. | |||||||||
| Storage Temperature | -40º to +85ºC. | |||||||||
2012mm,BC59,BC59CCD119.0-32.768K,Bomar32.768KHZ晶振 尺寸圖
2012mm,BC59,BC59CCD119.0-32.768K,Bomar32.768KHZ晶振
產(chǎn)品特性：
尺寸2.0x1.2mm
回流焊接
工作溫度為-40º至+85ºC。
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